Responsibilities:
- Become a process owner of many specific SIP assembly processes, primary wirebond and Datacon die attach.
- Backup the operation activities of other SIP assembly processes and oversee entire SIP assembly process flow
- Work in the prototype lab to participate in all SIP module build including hands-on machine programing and operations. After hours and weekend support are required occasionally
- Work with each process owners to develop, improve, and troubleshoot SIP assembly processes
- Initiate new equipment and process evaluation and buyoff plan
- Collaborate with R&D, QRE/NPI/FA teams on yield and quality issues. Investigate the root causes, trigger corrective actions and improvement plan and verify the effectiveness in the lab
- Initiate, lead and manage continuous process / yield improvement projects with process owners
- Work with each process owners to arrange and execute machine PM and keep spare parts of each machine to prevent machine downtime
- Arrange facility work, communicate with facility manager and team to resolve CDA, DI water, power issues to keep the lab in good operation condition
- Manage the floor plan, facility requirement, moving logistic for the new machine installation
- Join the weekly build plan meeting. Update daily build status. Response to all build status inquiries
- Perform design review and conduct Design for Manufacturability (DFM) and design rule optimization
- Work with packaging engineers on packaging and product development
- Create package drawings, specifications, reports, and production documentation using Cadence and AutoCAD
Requirements:
- Bachelor’s degree in Mechanical / Materials / Chemical and related engineering field
- Minimum 5 years of experiences in SIP assembly processes (SMT, die attach, wirebonding, molding, grinding, solder ball attach, laser marking, singulation, shielding...etc.)
- Hands on experiences wirebond, Datacon die attach, and other SIP assembly processes including machine programing and operations
- Solid technical understanding of full range of semiconductor packaging materials, material interactions, processes, critical parameters, dominant failure mechanisms and analytical techniques
- Understanding of statistics, control methodology, DOE, troubleshooting and problem solving techniques
- Good knowledge of packaging industry standards (IPC, JEDEC, IEEE, ISO, ANSI)
- Good project leading, communication and presentation skills
- A great team member
- Experience on AutoCAD is a plus
- After hours and weekend support are required occasionally
- Willingness to travel for training and machine buy-off
Job Type: Full-time
Pay: $70,000.00 - $110,000.00 per year
Experience level:
Work setting:
Ability to Commute:
- San Jose, CA 95131 (Required)
Ability to Relocate:
- San Jose, CA 95131: Relocate before starting work (Required)
Work Location: In person